Device Modeling
Our team of experienced engineers work with your team to provide modeling service performed by using IC-CAP and MBP. Our team provides cost-effective, high quality SPICE modeling services according to our clients’ timelines.
Our process supports CMOS, Bipolar, SOI, and HBT technologies. Our accurate and high quality service supports most commercially available SPICE models. We perform the extraction of SPICE models for analog, digital, mixed-mode and RF applications.
Our delivered services include
- Extraction of DC, AC (s-parameters), capacitance, temperature, and noise SPICE parameters
- Models for packaged parts or bare parts
- Test chip definition
- Interconnect modeling
- DC and RF modeling for MOSFET, SOI, FinFET, BJT/HBT, passive devices, etc.
- Noise modeling
- Model customization
Used models
- BSIM
- BSIMOI
- HICUM
- SGP
- VBIC
Above all, we build relationships with you, our client. Our innovative approach to modeling and our collaborative process allows us to really see to the core of the issue. It’s why we’re able to provide modeling services with accuracy and efficiency. Our combined experience and deep knowledge of device models makes us the premier choice for our clients.